Toshiba Corporation said Wednesday that it will collaborate with GlobalFoundries in the manufacture of Toshiba’s new “Fit Fast Structured Array” semiconductor products.
The Toshiba products will be made at GlobalFoundries’ eight fabrication facilities using 65-nanometer and 40-nm processes, with plans to work on 28-nm technology.
Toshiba’s FFSA products, developed in collaboration with BaySand, can be configured simply by customizing the design of a few metal layers, making the development process faster and providing more flexibility, Toshiba said in a statement.
By working with GlobalFoundries, Toshiba officials said they expect to be able to produce customer sample chips in as little as five weeks.
“We decided to partner with GlobalFoundries to manufacture FFSA wafers because it allows us to achieve the short turnaround time crucial to FFSA, for both engineering samples and mass production,” said Masakazu Kakumu, Toshiba’s executive vice president. “It also ensures that we can support high quality and yields with high-volume capacity.”
“We are very pleased to have been selected as the primary wafer foundry for Toshiba’s FFSA products,” said Chuck Fox, senior vice president of worldwide sales at GlobalFoundries.
GlobalFoundries operates its Fab 8 facility in the Luther Forest Technology Campus, where more than 2,000 people currently work. The company also has six fabrication plants in Singapore and one in Dresden, Germany. It is not clear where most of the Toshiba work will be done.
GlobalFoundries makes computer chips for more than 150 customers, including IBM, Qual-Comm and Advanced Micro Devices.